Location : Bayan LepasJOB DESCRIPTION:Part of company Back-end Advanced Package Development Team.Responsible towards package design, Signal and Power Integrity simulation, design verification for various company products (Microcontroller, Memory, Power Devices, ASIC, RF, Sensor, etc).Perform/Lead Package and PCB electrical model extraction (RLC, PDN), voltage and timing simulation for signal and power integrity analysis using industry standard Engineering Tools.Develop/Lead design guidelines for High-Speed interface (LPDDR, PCIE, MIPI, USB, FPD Link, etc).Involve in NPI of Semiconductor Packages design feasibility and turnkey with signal integrity focus.Participate/Lead simulation and measurement correlation activities, methodology development, continuous accuracy improvement.Work/Lead as a team across functionals with signal integrity centric for customer design adoption support activities.JOB REQUIREMENTS:PhD/Master/Bachelor Degree in Electrical, Electronics, Mechatronics,Optoelectronics, Power, Computer, Telecommunication, System, Software, Physic, Material, Mathematics, or relevant.Minimum 5 years semiconductor package development experience in design and/or simulation.Good knowledge in Transmission Line and Electromagnetic theory, D0C/AC signalling concept in time and frequency domain analysis.Extensive usage of Scattering Parameters for high-speed signals and power delivery network design concept and implementation is a plus.Hands on capability using Design and/or Simulation Tools (Cadence, ANSYS, Mentor, AutoCAD, ADS, Spice, or any relevant).Added advantage with experience working on IBIS model, Package/PCB level model extraction, full system voltage and timing simulation, lab measurements.Good analytical skills on signal integrity analysis (Eye Diagram, Jitter, power noise, signal crosstalk, ringing, lossy attenuation, overshoot/undershoot, etc).Knowledge in high-speed interface signal integrity design guidelines (LPDDR, PCIE, MIPI, USB, FPD Link, etc).Encourage extensive lab experience and inspire to venture into simulation hands- on or vice versa.#J-18808-Ljbffr